Contact plating is one of the most critical processes in reed switch manufacturing, and it greatly affects reed switch characteristics. In automatic plating equipment, the steps of the process (pre-treatment, underplating, contact plating, cleaning and drying) are controlled by computer so that plating is applied with high-precision. This automatic plating equipment was developed by OSDC, and is one of the key factors behind our high-quality reed switches.
In order to deactivate the rhodium-plated contact, we have developed a unique high temperature oxygen treatment. This technique makes the organic impurities built on the surface burned with oxygen and forms oxygen molecule layer on the contact which in turn provide stable contact resistance. This unique method won the highest prize (Schneider Award) at the 21st National Relay Conference in Oklahoma, USA, in 1973. Our technology is valued highly, and at the 36th and 38th Annual National Relay Conference we also received the Schneider Awards for research on reed switch contact surface phenomena.
Our patents have been registered in Japan (Pat. No. 916386), USA (Pat. No. 3857175) and Germany (Pat. No. 2303587).
Sealing is the process of forming the reed switch from the assembly of pressed and plated reed and glass tube. This is one of the most important processes which demands severe quality control and management. At the time of sealing, working temperature reaches 1,000? which makes the glass tube impurities evaporate and causes the reed switch contact surface to be contaminated. To prevent the effects of these phenomena, we have developed severe standards for selection of glass material. In addition we also use unique technology for automatic sealing. Improvements in manufacturing method such as these enable us to produce extremely high quality reed switches.
is performed under severe quality control and management. However, there is still a slight possibility for magnetic foreign particles to enter into the glass tube. We have conducted extensive research into the detection of microparticles and we developed the “Magnetic Flux Scanning Test” as an extremely high reliability technique for measuring contact resistance.
The magnetic attractive force from multiple layers of coils causes the magnetic foreign particles to move to the contact part of the reed switch. During check of the contact resistance, foreign particles are detected. Since we use this unique technology, we have succeeded in making rapid progress toward improving reed switch reliability.